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Senior Principal Chip Design Engineer (m/f/d)

What you will do
*Responsible to build technology platform for power device (IGBT) design and new technology development to meet customer requirement in a manufacturable and cost-effective way
*Responsible to improve the device overall performance for the existing products, in particular, to improve the device reliability and robustness
*Performing TCAD process and device simulations, and layout design
*Creating and maintaining design rules and generation rules when required using controlled procedures
*Responsible for engineering device test (static, dynamic, reliability, etc.) and data analysis, part of manually testing might be involved
*Coaching junior team member(s) in device design and process development
*Experience of IGBT design for EV/HEV application preferred
What you will need
*Minimum master’s degree in Microelectronics, semiconductor related or similar field
*Minimum 7 years working experience in IGBT (or FRD) design and/or processing
*Hand-on experience in power device design and technology development
*Proficiency in TCAD process and device simulation
*Understanding of power device physics, fabrication and characterization principles
*Knowledge and experience in design for reliability and robustness of power devices
*Ability to address design and engineering issues and to provide suitable solutions
*Leadership skills in building and leading project teams in a global, intercultural environment- “exemplified engagement”
*Good Communication skills in both oral and written English

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Senior Principal Chip Design Engineer (m/f/d)

Nexperia Germany GmbH
München
Vollzeit, Unbefristet

Veröffentlicht am 18.09.2024

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